The
purpose of the Student Design Contest is to promote excellence
in the design of electronic systems by providing competition between
graduate and undergraduate students at universities and colleges.


DESIGN
CONTEST WINNERS
OPERATIONAL
CATEGORY
1st Place $4,000
(session 44.5) A True Single-Phase 8-bit Adiabatic Multiplier
Suhwan Kim,Conrad H. Ziesler, Marios C. Papaefthymiou - Univ.
of Michigan
2nd Place $2,500
(session 9.1) Design of Half-Rate Clock and Data Recovery Circuits
for Optical Communication
Jafar Savoj, Behzad Razavi - Univ. of California, Los Angeles
2nd Place $2,500
Optimal Design of a Low Power, Low Noise 3.4 GHz CMOS Downconverter
Peter J. Vancorenland, Geert Van der Plas, Michiel Steyaert, Willy
Sansen - Katholieke Univ., Leuven, Belgium
CONCEPTUAL
CATEGORY
1st Place $4,000, Best Paper $1,000
(session 50.2) Two-Dimensional Position Detection System with
MEMS Accelerometer for MOUSE Applications
Seungbae Lee, Gijoon Nam, Junseok Chae, Hanseup Kim, Alan J. Drake
- Univ. of Michigan
2nd Place $2,500
A Configurable, Algorithm-Specific Processor for Real-Time
Wavelet-Based Video
Li Ding, Yi Li, Richard B. Brown - Univ. of Michigan 3rd Place
$1,500
VLSI Implementation of Binaural Spatializer Using FIR Head-Related
Transfer Function (HRTF)
NamSung Kim, Jiyoun Kim, Mingyu Cho, TaeYoung Choi, Trevor Mudge
Univ. of Michigan
HONORABLE
MENTIONS $500
A 1.8 GHz CMOS Cellular Transceiver Front-End: From Integrated
Circuit to Integrated System Design
Michiel Steyaert, Bram De Muer, Johan Janssens, Marc Borremans
- Katholieke Univ., Leuven, Belgium
HiPAR-DSP 16: VLSI-Design of a Second Generation Programmable
Parallel Multimedia-DSP
Willm Hinrichs, Jens Peter Wittenburg, Hanno Lieske, Helge Kloos,
Lars Friebe, Peter Pirsch - Univ. of Hannover, Germany
The contest will allow entries of both integrated
circuits and electronic systems (board-level design). It will
have two categories: 'Conceptual' and 'Operational.'
Operational designs will have
been implemented and tested. Proof of implementation in the form
of die- or board-photographs and measurement data must be supplied.
Conceptual designs need not
have been implemented but must have been thoroughly simulated
and must include a test plan.