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SESSION 48    INTERCONNECT EXTRACTION


48.1   Sparse Transformations and Preconditioners for Hierarchical 3-D Capacitance Extraction with Multiple Dielectrics
Author(s):Shu Yan, Vivek Sarin, Weiping Shi
Speaker(s): Shu Yan
PAPER >> - 48_1.PDF


SLIDES >> - 48-1.PPT


SESSION DESCRIPTION:
This session presents new developments in the area of 3D parasitic extraction.
The first paper performs capacitance extraction under multi-dielectric
environments. Next, a parasitic extractor for microelectronics, multichip
modules and MEMS which combines the fast multipole method with QR matrix
compression is presented. The third paper shows a method for determining
inductive noise coupling. A full wave field solver for RF, analog and
high-speed digital circuits is presented next. Finally, a presentation on a
technique that develops closed-form expressions for distributed RC
interconnects rounds out the session.