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Conference Program  Technical Session
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TUESDAY, July 25, 2006, 4:30 PM - 6:30 PM | Room: 306-308 |
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TOPIC AREA: LOW POWER AND THERMAL
(of special interest to designers)
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SESSION 11
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| | PANEL: Entering the Hot Zone -- Can You Handle the Heat and Be Cool?
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| | Chair: Daya Nadamuni - Gartner Dataquest, San Jose, CA
| | | Organizers: Michelle Clancy
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| | Electronic gadgets are becoming more pervasive at the office and in the home where they can no longer be equipped with large fans or vents. One of the biggest challenges is putting more functionality into a smaller space and managing heat dissipation. Lack of voltage scaling for future generations has forced designers to be more innovative to handle heat dissipation challenges. This panel discusses the breakthroughs required to address the power and thermal concerns for IC package and system designers, and the necessary cooperation between these teams and EDA companies.
Hot Zone Panel Extended Abstract
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| | 11.1 |
PANEL: Entering the Hot Zone -- Can You Handle the Heat and Be Cool?
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| | Speaker(s): | Javier De La Cruz - eSilicon Corp., Sunnyvale, CA
Uming Ko - Texas Instruments Inc., Dallas, TX
Simon Burke - ATI Technologies, Inc., Santa Clara, CA
Rajit Chandra - Gradient Design Automation, Santa Clara, CA
Andrew Yang - Apache Design Solutions, Inc., Mountain View, CA
Sribalan Santhanam - PA Semi, Santa Clara, CA
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