Conference Program    Technical Session

THURSDAY, July 27, 2006, 10:30 AM - 12:15 PM | Room: 303
TOPIC AREA:  BEYOND THE DIE
(of special interest to designers)

   SESSION 50
  Special Session: Key Technologies for Beyond the Die
  Chair: Mike Heimlich - Applied Wave Research, Inc., Pelham, NH
  Organizers: Lei He

  SIP (system-in-package) may reduce costs compared to SoC for heterogeneous integration. The first two papers discuss package-aware SoC design and system integration using silicon as carrier. The next two papers present high-speed links between chips in CMOS and optical technologies, respectively.

  50.1   The Importance of Adopting a Package-Aware Chip Design Flow
  Speaker(s): Kaushik Sheth - Rio Design Automation, Inc., Santa Clara, CA
  Author(s): Kaushik Sheth - Rio Design Automation, Inc., Santa Clara, CA
Egino Sarto - Rio Design Automation, Inc., Santa Clara, CA
Joel McGrath - Rio Design Automation, Inc., Santa Clara, CA
  50.2  Silicon Carrier for Computer Systems
  Speaker(s): Chirag Patel - IBM Corp., Yorktown Heights, NY
  Author(s): Chirag Patel - IBM Corp., Yorktown Heights, NY
  50.3s  4.25 GB/S Laser Driver: Design Challenges and EDA Tool Limitations
  Speaker(s): Benjamin J. Sheahan - Stanford Univ., Stanford, CA
  Author(s): Benjamin J. Sheahan - Stanford Univ., Stanford, CA
John W. Fattaruso - Texas Instruments Inc., Dallas, TX
Jennifer Wong - Texas Instruments Inc., Dallas, TX
Karlheinz Muth - Texas Instruments Inc, Dallas, TX
Boris Murmann - Stanford Univ., Stanford, CA
  50.4  Power-Centric Design of High-Speed I/O
  Speaker(s): Chih-Kong Ken Yang - Univ. of California, Los Angeles, CA
  Author(s): Hamid Hatamkhani - Univ. of California, Los Angeles, CA
Frank Lambrecht - Rambus, Inc., Mountain View, CA
Vladimir Stojanovic - Massachusetts Institute of Tech., Cambridge, MA
Chih-Kong Ken Yang - Univ. of California, Los Angeles, CA