Co-sponsored by EDN Worldwide and the TSMC Design Ecosystem
Will Kick-off the 44th DAC
Features a Dual-Panel Discussion: Design Challenges - A Real-time Reality Check
This popular kick-off reception will be an industry-wide welcome to DAC and will provide an opportunity to reconnect with a diverse group of colleagues in the EDA industry. The evening will feature a head-to-head discussion between two industry panels - a customer panel and a vendor panel - and will reflect attendees' input. One panel will consist of executives from companies designing advanced chips, and the other of technical executives from companies in the TSMC design ecosystem - providers of EDA design tools, libraries and IP, and design services. The panels will focus on the different categories of new chip design challenges to be encountered over the next two years. It promises to be a lively and entertaining evening that should provoke further discussion.
Panel Moderators:
* Ron Wilson, executive editor, EDN Magazine
* Ed Sperling, editor-in-chief, Electronic News
Register Now with EDAC
Co-Sponsored by:
Adjunct Event
