Search or browse RESULTS for:

SESSION 45    MODELING TECHNOLOGY IMPACT


45.4   Fast Capacitance Extraction in Multilayer, Conformal and Embedded Dielectric using Hybrid Boundary Element Method
Author(s):Ying Zhou, Zhuo Li, Weiping Shi
Speaker(s): Ying Zhou
PAPER >> - 45_4.PDF


SLIDES >> - 45-4.PPT


SESSION DESCRIPTION:
With technology scaling, the interaction between design practice (circuit and
layout) and performance and algorithms is becoming more complex. This session
includes a number of papers that examine this interaction at the device,
layout, and interconnect levels.