TUESDAY June 07, 3:00pm - 3:45pm | Booth #3421
TOPIC AREA: EMERGING TECHNOLOGIES
EVENT TYPE: PAVILION PANEL
3-D Extraction: Coming to a Design Near You?
Andrew B. Kahng - Univ. of California at San Diego, La Jolla, CA
Carey Robertson - Mentor, A Siemens Business, Wilsonville, OR
Ji Zheng - Apache Design, Inc., A Subsidiary of ANSYS, Inc., San Jose, CA
Sourav Chakravarty - Intel Corp., Portland, OR
Daniel Payne - Marketing EDA, Tualatin, OR
Smaller IC geometries and higher switching speeds require more accurate modeling and simulation technologies. Traditional pattern-based matching and rule-based extraction methods may not be accurate enough for today’s IC and package designs. 3-D extraction tool providers and designers will discuss 3-D field solver technology requirements, applications, and benefits.
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