MONDAY June 08, 10:30am - 12:00pm | Room 302
John Park - Mentor, A Siemens Business, Longmont, CO
Rajiv V. Joshi - IBM T.J. Watson Research Center, Yorktown Heights, NY
This session provides the fundamental knowledge, individual skill sets and the most recent state of the art technologies used for 2.5D/3D integration. In particular we present low cost silicon interposer, low power logic design techniques and EDA tools and methodologies to perform system co-design.
In his current role he serves as the Product Architect for Xpedition Package Integrator. Mr. Park studied microelectronics at California State University, Fullerton and holds a Certified Interconnect Designer certificate