SUNDAY June 05, 9:00am - 5:00pm | 17AB
TOPIC AREA: EMBEDDED SYSTEMS, DESIGN
KEYWORD: CYBER-PHYSICAL SYSTEMS, SYSTEM ARCHITECTURES & SOC, CODESIGN & SYSTEM DESIGN
EVENT TYPE: WORKSHOP
Workshop 3: System-to-Silicon Performance Modeling and Analysis - Power, Temperature and Reliability

Speakers:
Eugenio Villar - Univ. of Cantabria , Santander, Spain
Kim Grüttner - OFFIS, Oldenburg, Germany
Daniel Lorenz - OFFIS, Oldenburg, Germany
Ralph Weissnegger - CISC Semiconductor , Graz, Austria
Laurent Maillet-Contoz - STMicroelectronics, Grenoble, France
Franco Fummi - EDALab s.r.l., Verona, Italy
Emmanuel Vaumorin - Magillem Design Services, Paris, France
Roland Jancke - Fraunhofer IIS, Institutsteil EAS, Dresden, Germany
Michael Pronath - MunEDA GmbH, Munich, Germany
Gilson Wirth - Univ. Federal do Rio Grande do Sul, Rio Grande, Brazil
Organizers:
Adam Morawiec - Educational Computer Systems, Inc. , Belmont, France
Laurent Maillet-Contoz - STMicroelectronics, Grenoble, France
Kim Grüttner - OFFIS, Oldenburg, Germany
Gjalt de Jong - ArchWorks, Diegem, Belgium
The integration of heterogeneous electronic systems composed of SW and HW requires not only a proper handling of system functionality, but also an appropriate expression and analysis of various extra-functional properties: timing, energy consumption, thermal behavior, reliability, cost and others as well as performance aspects related to caching, non-determinism, probabilistic effects.

The workshop addresses cross-domain aspects related to the design and verification framework covering methodology, interoperable tools, flows, interfaces and standards that enable formalization, specification, annotation and refinement of functional and extra-functional properties of a system. Special emphasis will be given to formalization and expression of power, temperature, reliability, degradation and aging.

Several research and industry efforts address (parts of) the problem. However, there is a need for community-wide cooperation to establish a holistic vision on extra-functional property treatment, and to agree on research and development directions and further on validation of applicable solutions and standardization.

This event will support collaboration between main actors from system and microelectronics industry, EDA and research. The workshop is inviting submissions of short abstracts on industrial and scientific work in progress and practical solution and experiences.

Main topics
• Extra-functional property modeling (power, temperature, reliability, aging, …)
• Power and temperature analysis at SoC level: future needs and requirements
• Evolution and extensions of standards like UPF, IP-XACT to express extra-functional properties
• Power and temperature simulation and analysis at system-level
• System level reliability and aging models
• Reliability from transistor to RTL level: e.g. NBTI models including basic physical properties

Visit here for presentation list, abstracts and additional event details.