WEDNESDAY June 21, 1:30pm - 3:00pm | Ballroom F
TOPIC AREA: DESIGN, EDA
KEYWORD: TEST & VERIFICATION, SIMULATION & TIMING ANALYSIS, DIGITAL DESIGN
EVENT TYPE: REVIEWED PRESENTATIONS

SESSION 49
Advanced Chip Validation Techniques
Chair:
Kyungsu Kang - Samsung Electronics Co., Ltd., Hwaseong-si, Republic of Korea
The complexity of design validation has continued to grow in recent years, requiring a variety of new techniques and tools.  These include testing methodologies like UVM, portable stimulus, and hardware/software co-verification; use of analytics to improve regression flows;  and improvements in understanding and characterizing process-related design criteria.  This session will explore several new developments in these areas.

Thank You to Our Sponsor:


49.1Effectively Reduced Statistical Characterization Resource
 Speaker: EunYeung Yu - Samsung Electronics Co., Ltd., Hwaseong-si, Republic of Korea
 Authors: EunYeung Yu - Samsung Electronics Co., Ltd., Hwaseong-si, Republic of Korea
Eunbyeol Kim - Samsung Electronics Co., Ltd., Hwaseong, Republic of Korea
49.2The Hidden Gems of UVM : UVM Report Catcher, UVM Heartbeat and UVM Events
 Speaker: Vikas Billa - Microsemi Corp., Hyderabad, India
 Author: Vikas Billa - Microsemi Corp., Hyderabad, India
49.3A Real Example of Accellera's Portable Stimulus Used to Verify an LTE Switch
 Speaker: Adnan Hamid - Breker Verification Systems, Inc., San Jose, CA
 Author: Adnan Hamid - Breker Verification Systems, Inc., San Jose, CA
49.4Novel Approach to Hardware Software Co-Verification on Emulation
 Speaker: Ankit Anand - Cavium, San Jose, CA
 Authors: Nimalan Siva - Cavium, San Jose, CA
Ankit Anand - Cavium, San Jose, CA
Debdutta Bhattacharya - Mentor, A Siemens Business, Fremont, CA
Ayub Khan - Mentor, A Siemens Business, Fremont, CA
49.5Design Tracking and Analysis for Improved Design Automation Tools
 Speaker: Michael Kazda - IBM Corp., Poughkeepsie, NY
 Authors: Bill Dougherty - IBM Corp., Pittsburgh, PA
Michael Kazda - IBM Corp., Poughkeepsie, NY
49.6Thermal Exploration and Sign-Off Analysis for Advanced 3D Integration
 Speaker: Pascal Vivet - CEA-LETI & Laboratoire d'analyse et d'architecture des systèmes, Grenoble, France
 Authors: Cristiano Santos - CEA-LETI, Grenoble, France
Pascal Vivet - CEA-LETI & Laboratoire d'analyse et d'architecture des systèmes, Grenoble, France
Lee Wang - Mentor, A Siemens Business, Fremont, CA
Alexandre Arriordaz - Mentor, A Siemens Business, Grenoble, France