WEDNESDAY June 27, 9:00am - 9:20am | Room 3008
TOPIC AREA: DESIGN, IOT
KEYWORD: EMERGING ARCHITECTURES & TECHNOLOGIES, INTERCONNECTS, LOW-POWER & RELIABILITY
EVENT TYPE: VISIONARY TALK
Challenges to Enable 5G System Scaling
Speaker:
Chidi Chidambaram - Qualcomm Technologies, Inc. , San Diego, CA
A large fraction of the power reduction required to enable 3G and 4G came from plain digital CMOS scaling; however, at 5G, apart from the CMOS transistor, innovation from back end, other semiconductor components and their integration are required. The replacement rates for devices are slowing and the new markets for the semiconductor chips are where the chips must be built to last longer: leading us evolve from DFM, DFT to DFD – Design for Durability. Specific examples on the back-end modeling, prediction errors leading to wider product distributions and RF integration will illustrate the opportunities for the automation community in the upcoming 5G transition.  




Biography: Chidi Chidambaram leads the process technology and foundry engineering team at Qualcomm as Vice President Engineering. Chidi’s team has enabled Qualcomm to lead the fab less industry bringing leading edge semiconductor technologies to manufacturing - Qualcomm was the first company to ship large volume products in 10 nm technology in 2017. Chidi’s team is also enabling the transition of RF devices to 3D and SOI transistors. Chidi was very instrumental in creating a multi sourcing strategy for silicon wafers that was key to Qualcomm growing to be the leading cell phone chip supplier yet staying fabless. Earlier Chidi developed silicon technology at Texas Instruments and was instrumental in the first embedded SiGe implementation at TI; for which, he was recognized with the Andretti award. Chidi’s 20+ year semiconductor career has evenly straddled research and development with over 60 each of refereed articles and patents.