TUESDAY June 04, 3:00pm - 3:45pm | DAC Pavilion - Booth 871
Thank you to our DAC Pavilion Sponsor:
TOPIC AREA: DESIGN, EDA
KEYWORD: IMPLEMENTATION, EMERGING TECHNOLOGIES
EVENT TYPE: DAC PAVILION
ML/DL/AI for EDA: A Myth or A Reality?
Moderator:
Dr. Prith Banerjee - ANSYS, Inc., San Jose, CA
Organizer:
Vic Kulkarni - ANSYS, Inc., San Jose, CA
The panel will discuss emerging design implementation and signoff challenges for sub-7nm IP and SoC designs. Will ML/DL/AI innovations in EDA offer opportunities to meet the tough PPAR (Power, Performance, Area and reliability) goals and enable designers to shift left in TTR and TTM standards demanded by various verticals ranging from Autonomous, 5G, HPC, AI and next-generation of pervasive connectivity/mobility applications.
Dynamic voltage drop and its impact on timing
Role of emulation in analyzing thousands of real-life
scenarios
Synthesis-Place & Route challenges to reduce the new
"Design Capability Design Gap" (Ref: Prof. A. Kahng)
Reliability challenges for > 15 years life time including
EM, thermal, ESD, EOS, aging, etc.
On-chip and off-chip EM Noise coupling
Comprehensive mission profile coverage due to many cores/IPs
on SoC/3DIC
Multi-stacking WoW 3DIC for AI/5G applications with multiple
FinFET chips
Role of ML/DL/AI in EDA
Panelists:
Brucek Khailany - NVIDIA Corp., San Jose, CA
Levent Burak Kara - Carnegie Mellon Univ., Pittsburgh, PA
Mallik Tatipamula - Ericsson, Silicon Valley, CA
Dr. Duane Boning - Massachusetts Institute of Technology, Boston, MA
Sorin Dobre - Qualcomm Technologies, Inc., San Diego, CA
Levent Burak Kara - Carnegie Mellon Univ., Pittsburgh, PA
Mallik Tatipamula - Ericsson, Silicon Valley, CA
Dr. Duane Boning - Massachusetts Institute of Technology, Boston, MA
Sorin Dobre - Qualcomm Technologies, Inc., San Diego, CA
Thank you to our DAC Pavilion Sponsor:
