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The Design Automation Conference has been the most important resource for information on the electronic design and design automation industries for many decades.
Video Results for 48th DAC (2011)


CONVENED TUESDAY, June 07, 2011, 2:00 PM - 3:30 PM
VIDEO: SESSION 12
TOPIC AREA: INTERCONNECT AND RELIABILITY
RESEARCH PAPER SESSION: It's All in the Models...
Chair:
Eric Keiter - Sandia National Laboratories, Albuquerque, NM


Papers in this session emphasize the importance of proper modeling of the physical properties of systems. Good models capture relevant behavior accurately and can be efficiently generated and evaluated, enabling analysis of performance, yield, or reliability. The first three papers focus on model approaches to address manufacturing and operating conditions or process variations. The papers cover issues ranging from mechanical reliability, modeling spatial variations on an IC, and improving failure rate estimation. The final two papers address the efficiency of model generation and evaluation by employing careful statistical analysis as well as appropriate compressed representations.


12.1*TSV Stress-Aware, Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC
 Speaker: Moongon Jung - Georgia Institute of Technology, Atlanta, GA
 Authors: Moongon Jung - Georgia Institute of Technology, Atlanta, GA
Joydeep Mitra - Univ. of Texas at Austin, TX
David Z. Pan - Univ. of Texas at Austin, TX
Sung Kyu Lim - Georgia Institute of Technology, Atlanta, GA
12.2Hybrid Modeling of Non-Stationary Process Variations
 Speaker: Eva Dyer - Rice Univ., Houston, TX
 Authors: Eva Dyer - Rice Univ., Houston, TX
Mehrdad Majzoobi - Rice Univ., Houston, TX
Farinaz Koushanfar - Rice Univ., Houston, TX
12.3Efficient SRAM Failure Rate Prediction via Gibbs Sampling
 Speaker: Xin Li - Carnegie Mellon Univ., Pittsburgh, PA
 Authors: Changdao Dong - Carnegie Mellon Univ., Pittsburgh, PA
Xin Li - Carnegie Mellon Univ., Pittsburgh, PA
12.4Direct Matrix Solution of Linear Complexity for Surface Integral Equation-Based Impedance Extraction of High Bandwidth Interconnects
 Speaker: Wenwen Chai - Purdue Univ., West Lafayette, IN
 Authors: Wenwen Chai - Purdue Univ., West Lafayette, IN
Dan Jiao - Purdue Univ., West Lafayette, IN


* indicates Best Paper Candidate