TOPIC AREA: GENERAL INTEREST
Now, the continuing drive for more computing power, lower power consumption and less space to support smarter mobile devices raises new challenges to both design and EDA communities. For some of those challenges (including TSV, FinFet and Packaging), we will present industry perspectives based mostly on our experience at Samsung Semiconductor. We will also demonstrate synergic benefits of collaboration among multiple disciplines at Samsung Semiconductor to address the challenges.
Dr. NamSung (Stephen) Woo is a president of Samsung Electronics and GM of the System LSI business, which consists of three major business areas: SOC, LSI, and ASIC/Foundry. Samsung’s System LSI provides industry-leading Application Processors and CMOS image sensors for mobile devices. It also offers cutting-edge technologies (including 28nm HK/MG) for its ASIC/Foundry business. Dr. Woo has given a keynote talk at the CES 2013 in January 2013 and the ISCAS annual conference (sponsored by IEEE) in May 2012. He has published many technical papers and articles in journals and conferences (including DAC), and received a best paper award at the 31st DAC in 1994.
Prior to joining Samsung Electronics in 2004, Dr. Woo has managed engineering and business teams at Texas Instrument, Dot Wireless and Sansearch in San Diego, CA. He also worked at the Bell Laboratories in Murray Hill, New Jersey as a research scientist.
Dr. Woo received Ph.D. in computer science from Univ. of Maryland, College Park, MSEE from KAIST (Korea Advanced Institute of Science and Technology) and BSEE from Seoul National University.
Speaker: NamSung (Stephen) Woo - Samsung Group, Giheung, Republic of Korea