DAC 2011 SAN DIEGO JUNE 5-10
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Power Delivery from Package to Chip

Topic Area: Low-Power Design
Thursday, June 17, 2010
Time: 9:00 AM — 11:00 AM
Location: 208AB
Summary:

Power optimization and verification is one of the most challenging tasks that SOC design teams face. With each technology node the supply voltage is scaled down to keep dynamic power consumption under control. The resulting high current and smaller threshold voltages significantly reduce the design margins. In addition, sub-threshold leakage increases. The power infrastructure must be carefully designed and dimensioned on the chip, in the package and on the PCB. In this session, presenters from leading design companies will present various innovative solutions for the design and analysis of power distribution networks from various angles.

Sponsored by:

Moderator:Raj Varada - Intel Corp., Santa Clara, CA


9U.1 S— Package/PCB Aware On-Die Power Grid Noise Analysis

Speaker:Sorin Dobre - Qualcomm, Inc., San Diego, CA
Authors:Sorin Dobre - Qualcomm, Inc., San Diego, CA
 Amirali Shayan - Qualcomm, Inc., San Diego, CA
 Mikhail Popovich - Qualcomm, Inc., San Diego, CA
 Kevin Bowles - Qualcomm, Inc., San Diego, CA
 Xiaoming Chen - Qualcomm, Inc., San Diego, CA
 Christopher Pan - Qualcomm, Inc., San Diego, CA

9U.2 S— Power Shaping Methodology for Supply Noise and EMI Reduction

Speaker:Davide Pandini - STMicroelectronics, Agrate Brianza, Italy
Authors:Fabio Campi - STMicroelectronics, Bologna, Italy
 Tobias Bjerregaard - Teklatech A/S, Copenhagen, Denmark
 Mikkel Stensgaard - Teklatech A/S, Copenhagen, Denmark
 Davide Pandini - STMicroelectronics, Agrate Brianza, Italy

9U.3 S— Power Delivery Network Design and Analysis

Speaker:Erhan Ergin - Advanced Micro Devices, Inc., South Orange, NJ
Authors:Erhan Ergin - Advanced Micro Devices, Inc., South Orange, NJ
 Julius Din - Advanced Micro Devices, Inc., Sunnyvale, CA
 David Chakkuthara - Advanced Micro Devices, Inc., Austin, TX
 Tony Todesco - Advanced Micro Devices, Inc., Austin, TX
 Mark Frankovich - Advanced Micro Devices, Inc., Markham, ON, Canada
 Fei Guo - Advanced Micro Devices, Inc., Markham, ON, Canada
 Gabriel Wong - Advanced Micro Devices, Inc., Markham, ON, Canada
 Royston Sequeira - Advanced Micro Devices, Inc., Markham, ON, Canada
 Silqun Leung - Advanced Micro Devices, Inc., Markham, ON, Canada
 Thad Yogarasa - Advanced Micro Devices, Inc., Markham, ON, Canada

9U.4 S— Power Noise Mitigation Strategy from RLT Perspective on MTCMOS Design

Speaker:Leekee Yong - Intel Corp., Penang, Malaysia
Authors:Leekee Yong - Intel Corp., Penang, Malaysia
 Fern Nee Tan - Intel Corp., Bayan Lepas, Malaysia
 CheeSiong Lee - Intel Corp., Penang, Malaysia

9U.5 S— A Practical Framework for Statistical Leakage Estimation

Speaker:Kyung-Tae Do - Samsung, Yongin-City, Republic of Korea
Authors:Kyung-Tae Do - Samsung, Yongin-City, Republic of Korea
 Jung Yun Choi - Samsung, Yongin-City, Republic of Korea
 Seokhoon Kim - Samsung, Yongin-City, Republic of Korea
 Hyein Lee - Samsung, Yongin-City, Republic of Korea
 Hyo-Sig Won - Samsung, Yongin-City, Republic of Korea
 Kyu-Myung Choi - Samsung, Yongin-City, Republic of Korea

9U.6 S— An Accurate and Efficient SSO/SSN Simulation Methodology for 45nm LPDDR I/O Interface

Speaker:Souvik Mukherjee - Texas Instruments, Inc., Dallas, TX
Authors:Rajen Murugan - Texas Instruments, Inc., Dallas, TX
 Souvik Mukherjee - Texas Instruments, Inc., Dallas, TX
 Vinayakam Subramanian - Apache Design Solutions, Inc., Dallas, TX
 Ji Zheng - Apache Design Solutions, Inc., San Jose, CA

9U.7 S— A Comprehensive ESD Protection Design Flow Utilizing Suite of ESD Verification Tools in Advanced Technologies

Speaker:Mujahid Muhammad - IBM Corp., Essex Junction, VT
Authors:Mujahid Muhammad - IBM Corp., Essex Junction, VT
 Robert Gauthier - IBM Corp., Essex Junction, VT
 Junjun Li - IBM Corp., Essex Junction, VT
 Ahmed Ginawi - IBM Corp., Essex Junction, VT
 James Montstream - IBM Corp., Essex Junction, VT
 Souvick Mitra - IBM Corp., Essex Junction, VT
 Amol Joshi - IBM Corp., Essex Junction, VT
 Karen Henderson - IBM Corp., Westford, MA
 Nicholas Palmer - IBM Corp., Essex Junction, VT
 Brian Hulse - IBM Corp., Essex Junction, VT

9U.8 S— Ringing In and Out: Automated Creation of the SOC I/O Ring

Speaker:Ayon Dey - Texas Instruments, Inc., Bangalore, India
Authors:Ayon Dey - Texas Instruments, Inc., Bangalore, India
 Sean Boylan - Duolog Technologies Ltd., Galway, Ireland
 David Murray - Duolog Technologies Ltd., Galway, Ireland
 Bob Maaraoui - Texas Instruments, Inc., Dallas, TX




Design Automation Conference Sponsors IEEE Solid State Circuits Society Electronic Design Automation Consortium CEDA - IEEE Council on Electronic Design Automation SIGDA Special Interest Group - Design Automation